The chip company Intel may have found a new model for success: The company is not only working on better CPUs, but also with ASRock and TeamGroup on a technology that should significantly reduce the costs of DDR5 RAM.
The focus is on a new type of memory module design that ASRock has now officially presented. The “One sub-channel” technology is already supported at the BIOS level for Intel 600, 700 and 800 series motherboards. The goal is to reduce manufacturing costs while accelerating the spread of DDR5 memory – which is a very promising concept in the current memory crisis.
Conventional DDR5 modules work with a dual sub-channel architecture, i.e. two 32-bit channels, which together result in a bandwidth of 64 bits, as our colleagues at Neowin report. Although this design ensures high performance, it also increases production costs. The new solution instead relies on a single 32-bit sub-channel per module. This halves the number of memory chips required, making production cheaper.
This new type of module is called HUDIMM (“Half-Unbuffered Dual In-line Memory Module”). Despite the simplified architecture, compatibility with existing platforms is maintained, which is an important factor for PC manufacturers and upgraders. Intel sees this development as a decisive step: Innovations like these are necessary to keep desktop PCs affordable despite rising memory prices, explained Robert Hallock, manager in the company’s Enthusiast segment.
Internal performance tests should also show that users do not necessarily have to expect a loss in performance. According to ASRock, a combination of different modules, such as an 8 GB HUDIMM together with a classic 16 GB DDR5 module, can deliver even better results than a single 24 GB module with conventional architecture. Both higher data throughputs and lower latencies are mentioned. The concept thus contradicts the fear that cheaper storage solutions would inevitably come with a loss in performance.
Compact systems such as DeskMini PCs will also support the new storage technology in the future. What is noticeable, however, is that so far only Intel platforms have been taken into account. Although ASRock also produces motherboards for AMD, there is currently no announcement regarding support for the new HUDIMM modules on corresponding systems.
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