MediaTek Introduces Dimensity 9000 5G on 4nm Process

MediaTek has announced the new generation Dimensity 9000 5G chipset during the ongoing Summit. It’s built on a 4nm process and is the world’s first TSMC chipset with this process. It will improve the device’s performance, carrying that chip. It will also enhance the power efficiency of the device.

The MediaTek Dimensity 9000 5G uses ARM’s new core design, with a single Cortex-X2 core clocked at 3.05GHz, three Cortex-A710 cores clocked at 2.85GHz, and four Cortex-A510 efficiency cores clocked at 1.8GHz. The GPU is a 10-core Arm Mali-G710 that comes with MediaTek’s fifth-generation APU with six total cores for AI processing.

The new MediaTek chipset is also the world’s first SoC to include Bluetooth 5.3. The chip supports Wi-Fi 6E 2×2, is Bluetooth Audio LE-ready with Dual-Link True Wireless Stereo Audio, and supports the new Beidou III-B1C GNSS standard.

This high-performing chipset will support LPDDR5x RAM speeds of up to 7500Mbps in smartphones. The chip has 14MB of cache that improves performance by 7% and bandwidth consumption by 25% versus the older 8MB of cache.

The chip also improves the optics side of the device carrying it. Its ISP (Image Signal Processor) will be able to capture 4K HDR video from three cameras simultaneously, processing a total of 270 frames per second to output an 18-bit 4K HDR video. This ISP also supports camera sensors of up to 320MP.

MediaTek was a little too shy and occupied for not releasing any chipsets for the past few months. And now that the MediaTek Dimensity 9000 5G is official, we can see where the company was busy.

Last year, the company made nearly $10 billion. This year it’s expecting revenue of nearly $17 billion. David Ku, MediaTek’s chief financial officer, said that if a 4G chipset could be sold for $10, the 5G may carry a high price tag of as high as $50. He also added:

We need to have a very strong army to march into the segment. One product is not enough – this is our starting point.”