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More Leaks About Dimensity 7000 – Redmi Could be Using it Soon it Comes Out

MediaTek could announce the upper mid-range Dimensity 7000 in December 2021 or January 2022/

Mediatek Dimensity 7000

MediaTek recently introduced the new Dimensity 9000. It’s built on the 4nm process and carries heavy-performing equipment. The company is not stopping here. It also plans to introduce an upper mid-range chipset – Dimensity 7000.

The Dimensity 7000 will be built on the 5nm process and could compete with Qualcomm’s Snapdragon 870. According to reports, this chipset will come with an octa-core processor – 4 x Cortex-A78 cores working at 2.75GHz + 4 x Cortex-A55 cores clocking at 2.0GHz. The chip will have Mali-G510 MC6 for better graphics.

This upcoming chipset is also likely to come with support for 75W fast charging.

Recently, Redmi General Manager Lu Weibing showed his interest in the Dimensity 7000. It could be a hint that an upcoming Redmi smartphone would be using this chipset.

Mediatek has already begun testing the chipset. The chipset is expected to get an official announcement by December 2021 or January 2022. And perhaps the early devices using the new SoC could come in the following month.

Ron Harold

It has been a long time since I joined Research Snipers. Though I have been working as a part-time tech-news writer, it feels good to be part of the team. Besides that, I am building a finance-based blog, working as a freelance content writer/blogger, and a video editor.