Samsung denied utilizing its competitor’s technology for cutting-edge memory chips

Recently, we got to know that the South Korean tech giant Samsung will start working on advanced high bandwidth memory (HBM) chips. These chips are reportedly used for several purposes including artificial intelligence. According to reports, Samsung will build these chips utilizing technologies that rival SK Hynix, a local competitor, prefers. Perhaps the company intends to increase the yield of HBM chips, for this reason it is taking this step.

In the HBM market, SK Hynix has a strong foundation. As an established leader in the memory industry, Samsung will undoubtedly aim to take as much market share as possible. Samsung, on the other hand, denied that it will be using SK Hynix’s tech for manufacturing HBM chips.

Samsung relies on utilizing the non-conductive film method for manufacturing HBM chips. With the help of this technique, layers of chips are stacked on one another. Reportedly, it is quite an efficient approach for chips that have few layers. However, it doesn’t work well with chips having a greater number of layers that results in low yields. It could be the possible reason that Samsung is lagging behind in the HBM market and is unable to provide Nvidia with HBM3 chips.

SK Hynix, on the other hand, relies on using the mass reflow molded underfill process. It has a yield of 60-70% with no deficiencies that are reported with Samsung’s technique for HBM chips. With this approach, SK Hynix has gained a top position in the HBM market. Recently, the company signed a deal with Nvidia regarding the HBM3 chips.

Recently, a spokesperson from the company claimed that there is no truth in the reports that Samsung will use MR-MUF to its HBM production. In addition to this, he dismissed the thought of low yield with Samsung’s approach for HBM chips. He added that the company maintained a stable yield rate of its HMB3 chips.