Chip manufacturer TSMC, the Taiwan Semiconductor Manufacturing Company, is preparing to further shrink the technology after successfully starting production of chips with a structural width of just three nanometers. The first 2nm factories will soon appear.
TSMC announced this today. A statement from the company states that the new 3nm technology has successfully entered volume production with good yields. This means that mass production is running and Apple can be fully served as the first major customer.
The investment in advanced manufacturing capacities continues to meet the demand for 3nm technology: In the press release on the successful start, the chip manufacturer also celebrated the topping-out ceremony for its Fab 18 Phase 8 in the Southern Taiwan Science Park.
There will be produced in both the 5nm and 3nm processes. TSMC pointed out that 3nm is currently the most advanced semiconductor technology in terms of power consumption, performance, and area (PPA), offering a 1.6x increase in logic density and a 30-35% current reduction compared to the 5nm process.
Known for producing high-quality chips using advanced manufacturing processes, TSMC serves a variety of technology industry customers including Apple, Qualcomm, and Nvidia. Looking ahead, TSMC also now announced preparations for its first 2nm factories, which will be located in Hsinchu and central Taiwan science parks. These factories will consist of six phases and progress as planned.
Earlier, the company announced its plans to manufacture 4nm chips at its Arizona factory, which is set to open in 2024 due to growing demand from Apple.
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