MediaTek is well-known for its high-end as well as mid-range processors. In the high-end range, the company has introduced the Dimensity 9000 series. Whereas Dimensity 8000 series ahs been introduced as a mid-range line. As of now, the company has debuted the first chipset in the new Dimensity 7000 series. As per the company, the new chipset is named Dimesnity 7200.
The name of the latest chipset depicts that it is going to be positioned just beneath the upper mid-range series. Thus, a squarely mid-range offering can be anticipated from this latest chipset. Basically, the chipset is based on a 2nd generation TSMC 4nm process. It is similar to the one used for the flagship chipsets i.e., Dimensity 9200.
The core specs of the chipset consist of an octa-core Armv9 CPU. It has two Cortex-A710 cores clocked at 2.8GHz and six Cortex-A510 cores at an undetermined frequency. In addition to this, an Arm Mali-G610 MC4 GPU is also provided. Furthermore, the chipset has the capacity to support 32-bit apps through its tiny CPU cores.
Besides this, the chipset consists of:
- AI-based variable rate shading
- Bluetooth 5.3, and Wi-Fi 6E support
- APU 650 machine learning silicon
- a Release 16 sub-6GHz 5G modem
- 144Hz refresh rates at FHD+ display resolutions
When it comes to camera licenses, the Dimensity 7200 is provided with 200MP single-camera support. Some other notable features of the camera section include simultaneous dual video capture, 4K HDR video capture, and motion-compensated noise reduction in low light.
The company has affirmed that the first smartphone featuring the new Dimensity 7200 will be introduced in Q1 2023.
Brian is the news author at Research Snipers which mainly covers Technology News, Microsoft News, Google News, Facebook, Apple, Huawei, Xiaomi, and other tech news.