The release of the MediaTek Dimensity 8300 processor, is set to be unveiled on November 21. The processor is touted for its “Ice Peak efficiency and super god evolution.” According to a digital blogger on Weibo, the Dimensity 8300’s peripheral specification architecture aligns with the Dimensity 9 series, and its theoretical performance is expected to surpass that of the Snapdragon 7+ series.
Remarkably, its AnTuTu benchmark scores could even exceed those of the Snapdragon 8+.
The blogger revealed that the Dimensity 8300 scores around 1.5 million points in benchmarks, and its AI performance is unparalleled in its class. The Qualcomm Snapdragon 8+ is a well-regarded flagship chip used in several high-end smartphones like the Xiaomi 12S Ultra, Redmi K50 Supreme Edition, iQOO 10, and Huawei P60 Pro. Devices equipped with the Snapdragon 8+ have reached over 1.36 million points in AnTuTu benchmarks.
Given these insights, the MediaTek Dimensity 8300, aimed at the mid-range market, is expected to deliver impressive performance, potentially making it a new benchmark in mid-range processors. In terms of core specifications, the Dimensity 8300 is manufactured using TSMC’s N4 4nm process and features a 1+3+4 architecture. This includes a 3.35GHz Cortex-X3 super core, three 3.32GHz Cortex-A715 large cores, and four 2.2GHz Cortex-A510 cores, with a Mali-G615 MC6 GPU.
Interestingly, a device model Xiaomi 2311DRK48C, equipped with the Dimensity 8300, was recently spotted on Geekbench. This device is likely the upcoming Redmi K70E, which is expected to be the first smartphone to feature the new Dimensity 8300 processor.
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